Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model

The advantage of pure indium (In) for cryogenic joining has been acknowledged for many years. However, full characterization of its low-temperature rate-dependent behavior is lacking. In this work, a rate- and temperature-dependent constitutive model, the Anand model, was successfully applied to represent the inelastic deformation behavior of indium at low temperatures down to −150°C. Test data used for fitting the material parameters in the Anand model was acquired in a series of compression constant-load tests conducted under isothermal conditions at different temperatures ranging from −150°C to 0°C.