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| 两种含硅炔基树脂的固化行为研究 | |
| 引用本文： | 石松,孔磊,齐会民,张大海.两种含硅炔基树脂的固化行为研究[J].光谱学与光谱分析,2013,33(3):647-652. |
| 作者姓名： | 石松 孔磊 齐会民 张大海 |
| 作者单位： | 1. 天津工业大学材料科学与工程学院，天津 300160 2. 航天材料及工艺研究所先进功能复合材料技术重点实验室，北京 100076 3. 华东理工大学材料科学与工程学院，上海 200237 |
| 基金项目： | 总装预先研究项目(513120200306)资助 |
| 摘 要： | 综合采用红外光谱（FTIR）、核磁碳谱 (13C NMR)、差示扫描量热（DSC），热失重测试(TGA)等多种表征手段，研究了聚硅芳炔（PAR）和聚硅乙炔（PMR）两种含硅炔基树脂的固化行为，讨论了树脂固化物的结构与热稳定性的关系。结果表明：PAR和PMR树脂的固化机理不同，PAR主要通过炔基间的加成和Diels-Alder反应实现分子间的固化交联，并最终形成由苯环和稠芳环组成的芳构网络;PMR则主要通过硅氢基、炔基、烯基之间的加成反应实现固化，并成形饱和的碳硅Si—C(sp3)网络结构。固化成型的芳构网络和Si—C(sp3)网络结构分别赋予了PAR和PMR树脂固化物良好的热稳定性能，它们的热分解温度Td5均大于600 ℃，900 ℃残重率均达到85%以上。 |
| 关 键 词： | 含硅炔基树脂 固化行为 红外光谱 核磁共振 |
| 收稿时间： | 2012-08-14 |
The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group |
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| SHI Song,KONG Lei,QI Hui-min,ZHANG Da-hai.The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group[J].Spectroscopy and Spectral Analysis,2013,33(3):647-652. | |
| Authors: | SHI Song KONG Lei QI Hui-min ZHANG Da-hai |
| Institution: | 1. Tianjin Polytechnic University, School of Materials Science and Engineering, Tianjin 300160, China2. Aerospace Research Institute of Materials & Processing Technology, Science and Technology on Advanced Functional Composites Laboratory, Beijing 100076, China3. School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China |
| Abstract: | In the present report, the curing behavior of two thermoset resins containing silicon alkynyl group- PAR and PMR, and the correlation between the curing structure of resin and their thermal stability were investigated by FTIR, 13C NMR, DSC and TGA techniques. The IR and NMR results showed that the curing mechanism of PAR and PMR resin is different. Based on aromatic cyclization among alkynyl groups and Diels-Alder reaction, aromatic frame network structure constituted by benzene cycles and condensed aromatic cycles are formed in the PAR cured resin. Using additional reaction among Si—H group, alkynyl group and alkenyl group, saturated Si—C(sp3) network structure is formed in the PMR cured resin. The aromatic frame network structure and Si—C(sp3) network structure provide good thermal stability for PAR and PMR resin respectively. The thermal decomposition temperatures Td5 of both resins are above 600 ℃, and the residues percentages at 900 ℃ are above 85%. |
| Keywords: | Resins containing silicon alkynyl group Curing behavior FTIR NMR |
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