Investigation on thermal contact resistance by photothermal technique at low temperature

The interface thermal contact resistance between the copper and stainless steel thin disk is investigated using the non-contact photo-thermal technique. The diffusivity and the interface thermal contact resistance were estimated using the phase sensitivity measurement over a temperature range from 20 to 300 K, at 1.20, 2.38 and 4.28 MPa contact pressure, respectively. Results show that the interface thermal contact resistance decreases with the rise of the temperature and contact pressure.