High-temperature application of the low-emissivity Au/Ni films on alloys |
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Authors: | Zhibin Huang Wancheng Zhou Xiufeng Tang Fa Luo Dongmei Zhu |
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Institution: | State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China |
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Abstract: | The 200 nm-thickness Ni film was imposed as the diffusion barrier layer between the Au film and the alloy substrate to improve the low-emissivity durability of the Au film at high temperature. The results show that the Au/Ni multilayer films still kept low emissivity after working at 600 °C for 200 h. It was concluded that the Ni interlayer effectively retarded the diffusion between gold film and the metal alloy below 600 °C. |
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Keywords: | 81 05 &minus t 61 80 Ba 68 60 &minus p 66 30 Ny |
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