Characterization of the surface topography and nano-hardness of Cu/Ni multilayer structures |
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Authors: | Edyta Kulej Barbara Kucharska Grzegorz Pyka Monika Gwo?dzik |
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Institution: | 1.Institute of Materials Engineering,Czestochowa University of Technology,Czestochowa,Poland;2.Department of Metallurgy and Materials Engineering,Katholieke Universiteit Leuven,Heverlee,Belgium |
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Abstract: | This article describes the results of a study of Cu/Ni multilayer coatings applied on a monocrystalline Si(100) silicon substrate
by the deposition magnetron sputtering technique. Composed of 100 bilayers each, the multilayers were differentiated by the
Ni sublayer thickness (1.2 to 3 nm), while maintaining the constant Cu sublayer thickness (2 nm). The multilayer coatings
were characterized by assessing their surface topography using atomic force microscopy and their mechanical properties with
nano-hardness measurements by the Berkovich method. The tests showed that the hardness of multilayers was substantially influenced
by the thickness ratio of Cu and Ni sublayers and by surface roughness. The highest hardness and, at the same time, the lowest
roughness was exhibited by a multilayer structure with a Cu-to-Ni sublayer thickness ratio of 2:1.5. |
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