| SnAgCu无铅焊点的电迁移行为研究 |
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| 引用本文： | 何洪文,徐广臣,郝虎,雷永平,郭福.SnAgCu无铅焊点的电迁移行为研究[J].电子元件与材料,2007,26(11):53-55. |
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| 作者姓名： | 何洪文 徐广臣 郝虎 雷永平 郭福 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022 |
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| 基金项目： | 北京市科技新星计划项目
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教育部新世纪优秀人才支持计划霍英东基金
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北京市属市管高校人才强教计划 |
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| 摘 要： | 电迁移引发的焊点失效已经成为当今高集成度电子封装中的最严重的可靠性问题之一。应用SnAgCu无铅焊膏焊接微米级铜线,进行电迁移实验。结果表明:焊点形貌从原来的光滑平整变得凹凸不平,阴极处出现了裂纹和孔洞,并且在铜基板和Cu6Sn5金属间化合物(IMC)之间出现薄薄的一层Cu3Sn金属间化合物,由ImageJ软件测量其平均厚度约为2.11μm;而在阳极附近没有明显的Cu3Sn金属间化合物形成。
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| 关 键 词： | 电子技术 电迁移 金属间化合物 无铅焊点 |
| 文章编号： | 1001-2028（2007）11-0053-03 |
| 修稿时间： | 2007-08-01 |
Electromigration behavior of SnAgCu lead-free soldering point |
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| HE Hong-wen,XU Guang-chen,HAO Hu,LEI Yong-ping,GUO Fu.Electromigration behavior of SnAgCu lead-free soldering point[J].Electronic Components & Materials,2007,26(11):53-55. |
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| Authors: | HE Hong-wen XU Guang-chen HAO Hu LEI Yong-ping GUO Fu |
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| Abstract: | Failure in solder joints caused by electromigration has become one of the most serious reliability problems in higher integration electronic packaging nowadays. Sn-3.8Ag-0.7Cu lead-free solder paste was applied to join two Cu wires (D = 500 μm) as the electromigration experimental solder joints. The results indicate that the whole appearance of the solder joint became accidented comparing with the before. Some cracks and voids appeared along the interface and the thin layer existed between the copper substrate and Cu6Sn5 Intermetallic compound (IMC) in the cathode. It is Cu3Sn identified by EDX. Using the ImageJ software to measure the average thickness of Cu3Sn IMC is about 2.11 μm. No distinct Cu3Sn IMC is observed in the anode. |
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| Keywords: | electron technology electromigration intermetallic compound lead-free soldering point |
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