Cu/Ni-P多层膜的制备及其摩擦学性能研究

用电沉积方法制备了软硬层交替的Cu／Ni-P多层膜，用原子力显微镜观察分析了多层膜的表面形貌，用X射线衍射仪测定了其相结构；采用动一静摩擦系数精密测量装置考察了多层膜的摩擦学性能和摩擦磨损机制；采用扫描电子显微镜观察分析了其磨损表面形貌．结果表明：Cu／Ni-P多层膜与钢球对摩时具有较好的抗磨减摩性能；在低载荷和低滑动速度下，多层膜的磨痕表面存在擦伤痕迹和较浅的犁沟；在高载荷下多层膜发生严重粘着磨损和剥落。

Preparation and Tribological Properties of Cu/Ni-P Multilayer Electrodeposited on Beryllium Bronze

Cu/Ni-P multilayer was electrodeposited on beryllium bronze substrate by bi-pulse plating. The friction and wear behavior of the resulting multilayer sliding against AISI-52100 steel ball was investigated on a unidirectional friction and wear tester in a ball-on-disc configuration. The morphology and wear mechanisms of the multilayer were analyzed based on atomic force microscopic and scanning electron microscopic analyses of the original and worn surfaces of the multilayer. As the results, the Cu/Ni-P multilayer was compact and smooth and showed high hardness and good antiwear and friction-reducing behavior at smaller load and sliding speed. The increased wear-resistance of the Cu/Ni-P multilayer was related to the decreasing of the grain size in the presence of P, which contributed to retard the generation and growth of the Ni nuclei along the (111) plane and hence to increase the hardness and wear-resistance of the multilayer. The increased wear-resistance of the Cu/Ni-P multilayer was also dependent on its transfer onto the worn surface of the counterpart AISI-52100 steel to some extent. The Cu/Ni-P multilayer sliding against the steel at smaller load and sliding speed was characterized by slight scuffing and adhesion, while it experienced severe adhesion and plastic deformation as slid against the steel counterpart at a larger load.