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A method for measuring the electromechanical coupling factor of piezoelectric materials by means of transient response
Authors:Y. Kikuchi  C. Kasai
Affiliation:Tohoku Institute of Technology, Sendai, Japan;Aloka Co., Ltd., Mure 6, Mitaka-shi, Tokyo, Japan
Abstract:Transient response of thickness mode piezoelectric plates is theoretically analyzed using a transmission line type equivalent circuit. From the analysis, a method for measuring the electromechanical coupling factor is proposed called the “Transient Response Method”. Experiments showed good agreement with the theory. The feature of this transient response method depends upon the fact that the electromechanical coupling factor of the thickness mode can be measured, when samples have a smaller ratio of diameter to thickness than the usual ratio required in the resonance-antiresonance method.
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