Thermal conductivity epoxy resin composites filled with boron nitride |
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| Authors: | Junwei Gu Qiuyu Zhang Jing Dang Chao Xie |
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| Institution: | 1. Key Laboratory of Space Applied Physics and Chemistry, Ministry of Education, School of Science, Northwestern Polytechnical University, , Xi'an, 710072 China;2. +86‐29‐88431675;3. Department of Oral Implantology, School of Stomatology, Fourth Military Medical University, , Xi'an, 710032 China |
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| Abstract: | Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd. |
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| Keywords: | epoxy resin boron nitride thermal conductivity |
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