Configurations of high-frequency ultrasonics complex vibration systems for packaging in microelectronics |
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Authors: | Tsujino Jiromaru Harada Yoshiki Ihara Shigeru Kasahara Kohei Shimizu Masanori Ueoka Tetsugi |
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Affiliation: | Faculty of Engineering, Kanagawa University, 3-27-1 Rokkakubashi, Kanagawa-ku, Yokohama 221-8686, Japan. tsujino@cc.kanagawa-u.ac.jp |
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Abstract: | Ultrasonic high-frequency complex vibrations are effective for various ultrasonic high-power applications. Three types of ultrasonic complex vibration system with a welding tip vibrating elliptical to circular locus for packaging in microelectronics were studied. The complex vibration sources are using (1) a longitudinal-torsional vibration converter with diagonal slits that is driven only by a longitudinal vibration source, (2) a complex transverse vibration rod with several stepped parts that is driven by two longitudinal vibration source crossed at a right angle and (3) a longitudinal vibration circular disk and three longitudinal transducers that are installed at the circumference of the disk. |
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