| 用氢等离子清洗改善BGA的可焊性 |
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| 引用本文： | 林伟成.用氢等离子清洗改善BGA的可焊性[J].电子工艺技术,2012(6):351-354,376. |
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| 作者姓名： | 林伟成 |
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| 作者单位： | 中国电子科技集团公司第三十八研究所 |
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| 摘 要： | BGA器件的焊球往往都非常容易氧化,焊接后的BGA焊点不仅外观上不过关,其电性能和热性能也大打折扣。但是BGA焊球的去氧化问题一直没有很好的解决方法。介绍一种氢等离子体再流焊去氧化物的方法,该方法把氢等离子体和适度加热有机地结合在一起,能有效地去除BGA焊球表面的氧化物。该方法工艺简单,效果显著,效率也很高,是清除BGA元器件和其他表面贴装元器件氧化物的最佳方法。
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| 关 键 词： | BGA 焊球 氧化物 氢等离子体 |
Improving Solderability of BGA with Hydrogen Plasma |
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| LIN Wei-cheng.Improving Solderability of BGA with Hydrogen Plasma[J].Electronics Process Technology,2012(6):351-354,376. |
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| Authors: | LIN Wei-cheng |
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| Institution: | LIN Wei-cheng(No.38 research institute of China electronics technology group corporation,Hefei 230088,china) |
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| Abstract: | The solder balls of BGA are very easily oxidized.The appearance of BGA solder joints after reflow solder are unqualified,their electronic properties and thermal properties are very bad too.The deoxidation problem of BGA solder balls has not been solved.Introduce a good deoxidation method with hydrogen plasma reflow solder.This method organically combines hydrogen plasma and heating properly,it can effectively remove oxide layer of BGA solder balls.This method and process are simple,the result is noticeable,and the efficiency is high too.It is the best method to remove oxide layer of BGA and other surface mounting devices. |
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| Keywords: | BGA solder balls oxide layer Hydrogen plasma |
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