Fracture mechanics analysis on Smart-Cut~ technology.Part 1:Effects of stiffening wafer and defect interaction

In the present paper,continuum fracture mecha-nics is used to analyze the Smart-Cut process,a recentlyestablished ion cut technology which enables highly efficientfabrication of various silicon-on-insulator(SOI)wafers ofhigh uniformity in thickness.Using integral transform andCauchy singular integral equation methods,the mode-I andmode-Ⅱ stress intensity factors,energy release rate,and crackopening displacements are derived in order to examine seve-ral important fracture mechanisms involved in the Smart...