LiNbO3芯片的无损边缘抛光实验

以抛光垫抛光工艺为基础，研究出一套完整的新型无损边缘抛光工艺，成功实现了高精度光纤陀螺集成光学调制器LiNbO3芯片边缘的无损抛光。即在分析LiNbO3芯片边缘抛光过程中棱边损伤产生原因的基础上，提出3条解决措施:控制研抛浆料中的大颗粒；选择低亚表面损伤的抛光方式；抛光颗粒的大小接近或小于临界切削深度的2倍。加工工件棱边在1 500显微镜下观察无可见缺陷，芯片端面的表面粗糙度Ra0.8 nm，表面平面度优于/2，满足了LiNbO3芯片无损边缘抛光要求。同时，该工艺方法具有较大的推广应用价值。

Experiment on defect-free edge polishing of LiNbO3 chips

To meet the requirements for defect-free edge polishing of high-precision fiber optic gyroscope integrated optic modulator LiNbO3 chips, a new polishing process based on pad polishing was developed. According to the analysis on the causes for edge damage during the edge polishing, three solutions were presented:controlling the big particles in polishing material, choosing the low sub-face damage polishing and making the particles size close to or less than double of the critical cutting depth. With the new process, the defect-free edge polishing of LiNbO3 chips could be achieved and the results show that the edges under 1 500 microscope have no visible defect, the chip end face roughness Ra is less than 0.8 nm and the surface flatness reaches better than /2.Additional,this polishing process has great application value.