Analysis of Multilayered Millimeter Wave Structure with Via-Holes Connected

An effective technique to characterize multilayered millimeter wave structure with vertical via-holes connected is presented. The advantage of this method is the closed-form Greens functions in spatial domain for general electric and magnetic sources in multilayered medium are obtained easily in terms of the two-level discrete complex image method (DCIM) with the high-order Sommerfeld identities, which only four elements of Greens functions in spectral domain are needed. In addition, the curl operators in mixed potential integral equations (MPIE) are avoided effectively from the Greens functions in this paper. A low temperature co-fired ceramic (LTCC) aperture coupled antenna with vertical via-holes connected is analyzed to prove the accuracy and efficiency of this technique on three-dimensional (3-D) multilayered structure with vertical components.