用芯片图形与数据带比较检查掩模缺陷 |
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引用本文: | 胡道媛. 用芯片图形与数据带比较检查掩模缺陷[J]. 电子与封装, 2002, 2(1): 28-33 |
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作者姓名: | 胡道媛 |
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作者单位: | 中国华晶电子集团公司掩模工厂,江苏,无锡,214061 |
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摘 要: | 为了零缺陷的突破,本文介绍芯片图形与数据带(Die-to-date base)比较检查掩模版缺陷的原理,系统组成和数据结果分析。
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关 键 词: | 定义缺陷 RTB 圆角 RIA |
修稿时间: | 2001-11-28 |
Using Die - to - database Comparison Inspection Defects Technology of Mask |
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Abstract: | In order to ensure zero defects,this paper introduced die-to-database comparison inspection principle of mask plate defects,consists of system and data result analysis. |
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Keywords: | Define defects RTB Corner rounding RIA |
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