印制板组件无铅化装配的清洗考虑

使用无铅化材料意味着要对满足可靠性进行重新评估和复测。无铅化焊接所采用的焊剂化学物质具有相当强大的和富有腐蚀性的酸，以应对为确保具有良好的可焊性能所采用的较高的工艺操作温度。对于无铅化电路来说焊膏残余物与含铅焊膏残余物的化学物是不一样的，在经历了较高的工艺操作温度以后，聚合了较大的能级，使用以往的清洗类产品可能无法达到有效的清洗效果。有效的清洗是确保装配工作不至失败的最好途径。

The Cleaning Issues for Lead-Free PCB Assembling

Using Pb-free materials means re-evaluation and retesting for reliability.Pb-free soldering introduces a flux chemistry that uses more powerful and aggressive acids to cope with higher processing temperatures while maintaining good solderability.Solder paste residues for Pb-free circuits are chemically different than Pb-based ones,undergo higher processing temperatures,polymerize to a greater degree and may not respond to cleaning using older types of cleaning products.Effective cleaning is the only way to guarantee an assembly won＇t fail.