Bulk electrochemical etching of semiconductor single-crystal silicon in HF-containing solutions

Effect of the component composition of an HF-containing electrolytic aqueous solution on the polishing electrochemical etching of semiconductor single-crystal silicon was studied. Propanol-2, SV-1017, and NH₄F served as additional components of solutions used for this purpose. The conditions in which this process can be employed to form elements with 3D structure in microsystems devices were determined. An analysis of the results obtained led to an assumption that the hydrogen passivation of the surface of semiconductor single-crystal silicon is the rate-determining factor affecting the development of a bulk polishing electrochemical etching of this material. Because the process of polishing electrochemical etching of silicon wafers is preserved during approximately 20 min, the method is acceptable for formation of shallow grooves in microsystems devices.