The mechanism and kinetics of curing reaction of AG-80/SED system by DSC |
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Authors: | Youqing Hua Dongmei Zhao Xuhui Quan |
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Affiliation: | (1) Beijing University of Chemical Technology, 100029 Beijing, P. R. China |
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Abstract: | The mechanism and kinetics of curing reaction of tetrafunctional epoxy resin (Ag-80)/novel diamines curing (SED) system were studied by non-isothermal and isothermal DSC. Different equivalent ratios of amine-epoxide give rise to different curing mechanisms. The main condensation reaction can be attributed to the reactions between the primary amine and epoxide and between the hydroxyl and epoxide when temperature is below 200°C, and to the reaction between the second-ary amine and epoxide when temperature is above 200°C. The corresponding apparent activation energies are 58.3 kJ·mol?1 and 99.3 kJ·mol?1 respectively. Apparent activation energies of condensation reactions between primary amine and epoxide and between hydroxyl and epoxide are just the same, which are 47.3 kJ·mol?1. |
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Keywords: | cure DSC sulfone ether diamines (SED) tetrafunctional epoxy resin (Ag-80) |
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