Conditions for Cracking and Debond Development at Partially Bonded Bimaterial Half-Planes

Fracture phenomena at the debond tip of partially bonded bimaterial half-planes subjected to concentrated normal forces, couples, and uniform tension are considered. The crack initiation conditions are described by the stress distribution before the initiation and the energy release rate of the crack immediately after the initiation. The debond development conditions are described by the stress distribution and the energy release rate of the debond before its initiation. When both the crack and the debond have chances to occur, or when cracks can arise in both the materials, the fracture phenomena are predicted by comparing the ratio of energy release rates and the ratio of fracture toughnesses.