Lithography with silicon ions |
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Authors: | I Adesida M Zhang E D Wolf |
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Institution: | (1) National Research and Resource Facility for Submicron Structures, School of Electrical Engineering Cornell University, 14853 Ithaca, New York |
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Abstract: | Some applications of focussed ion beams are discussed with special emphasis on the lithography aspects. Experimental data on the ranges of H+, Be+ and Si++ in polymethylmethacrylate (PMMA) are presented. The sensitivity of PMMA to Si++ ions is measured to be 0.35 µC/cm2. It is shown by replication through a transmission mask that Si++ ions with low to moderate incident energies, such as found in focussed ion beam systems, can be used for submicrometer lithography in single and multi-layer resist systems. |
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Keywords: | Lithography Focussed ion beam Silicon ions Polymethyl methacrylate Multilayer resist |
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