In situ processing of III–V semiconductors: Mile stones and future prospects

In situ processing combined with metalorganic vapor phase epitaxy (MOVPE), molecular beam epitaxy, or chemical beam epitaxy appears to be an attractive method for fabricating sophisticated optoelectronic devices such as buried heterostructure lasers, vertical cavity surface emitting lasers, and photonic integrated circuits. Successful reduction of residual contaminants at the regrowth interface and improvement in the optical and electrical quality of the regrown layer has been achieved by using in situ processing techniques. Device fabrication is alrady taking advantage of this kind of technology. Nevertheless, interface quality between an in situ etched layer and a regrown layer has not yet reached the status of continuously grown interfaces. In this paper, progress of in situ processing is reviewed mainly focusing on our recent studies on in situ HCl gas etching in MOVPE. The approach of two-step HCI gas etching has proven superior to obtain clean regrowth interfaces, leading to the conclusion that the in situ processing can be widely used for advanced optoelectronic device fabrication.