| 激光微孔加工技术在印刷线路板生产中的应用 |
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| 引用本文： | 张翠红,杨永强.激光微孔加工技术在印刷线路板生产中的应用[J].激光与光电子学进展,2005,42(3):48-52,14. |
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| 作者姓名： | 张翠红 杨永强 |
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| 作者单位： | 华南理工大学机械工程学院,广州,510640 |
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| 摘 要： | 在印刷线路板(PCB)加工业中，微孔加工技术一直是制约该丁业发展的主要因素之一，人们对体积小、功能强、性能稳定的产品需求不断推动这项技术的发展。介绍了激光技术在微孔加工方面的应用，阐述了微孔加工的机理、设备、工艺方法及所涉及到的PCB板材料。
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| 关 键 词： | 印刷线路板 加工技术 应用 微孔加工 产品需求 性能稳定 激光技术 PCB板 工艺方法 加工业 体积小 |
| 收稿时间： | 2004/11/5 |
Application Of Laser Microvia Machining In PCB Industry |
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| ZHANG Cuihong,YANG Yongqiang.Application Of Laser Microvia Machining In PCB Industry[J].Laser & Optoelectronics Progress,2005,42(3):48-52,14. |
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| Authors: | ZHANG Cuihong YANG Yongqiang |
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| Abstract: | Laser drilling has emerged in the past several years as the most widely accepted method of creating microvias in high-density electronic interconnect and chip packaging devices. The continued emphasis on faster, smaller, and lighter electronic systems is driving world markets in advanced printed circuit boards (PCB) and substrate technologies forward. The application of this technology is introduced in this paper, and also machining mechanisms , machining methods , machining process and laser equipment are presented respectively. |
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| Keywords: | laser microvia machining mechanisms PCB substrate |
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