| 圆片级封装的凸点制作技术 |
| |
| 引用本文： | 张彩云,任成平.圆片级封装的凸点制作技术[J].电子工艺技术,2006,27(3):159-161,164. |
| |
| 作者姓名： | 张彩云 任成平 |
| |
| 作者单位： | 中国电子科技集团公司第二研究所,山西,太原,030024;太原职业技术学院,山西,太原,030021 |
| |
| 摘 要： | 圆片级封装是一种先进的电子封装技术,近年来,圆片级封装技术的发展速度很快,主要应用于系统级芯片、光电器件和MEMS等.凸点制作是圆片级封装工艺的关键工序,目前凸点制作工艺方法有多种,重点介绍常用的电镀法、植球法和蒸发沉积法凸点工艺,分别介绍这三种凸点制作技术的工艺流程、关键技术.
|
| 关 键 词： | 圆片级封装 凸点制作 电镀法 植球 |
| 文章编号： | 1001-3474（2006）03-0159-04 |
| 收稿时间： | 2006-04-11 |
| 修稿时间： | 2006-04-11 |
Wafer Bumping Technology for WLP |
| |
| ZHANG Cai-yun,REN Cheng-ping.Wafer Bumping Technology for WLP[J].Electronics Process Technology,2006,27(3):159-161,164. |
| |
| Authors: | ZHANG Cai-yun REN Cheng-ping |
| |
| Institution: | 1. CETC No. 2 Research Institute, Taiyuan 030024, China; 2. Taiyuan Vocation Technology College, Taiyuan 030021, China |
| |
| Abstract: | WLP is an advanced technology in the electronic packaging.Over the last few years,WLP has developed rapidly.It is applied in SOC,FPA and MEMS so on.Wafer bumping is a key working procedure of WLP.Now there are various wafer bumping process.Introduce electroplating of bump,solder sphere placement,and evaporation indium processes that they are current technique of wafer bumping,including process procedure and key technology. |
| |
| Keywords: | WLP Wafer bumping Electroplating of bump Solder sphere placement |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
