Nucleation and growth of Cu onto polycrystalline Pt electrode from acidic CuSO4 solution in the presence of H2SeO3

The early stages of Cu electrodeposition onto Pt(poly) have been investigated in 0.5 M H₂SO₄ + 0.01 M CuSO₄ solution without or with H₂SeO₃ when a molar concentration ratio [Cu(II)]/[Se(IV)] ≥ 2×10² using electrochemical and ex situ AFM techniques. The overpotential deposition of Cu has been performed onto a Pt surface precovered independently with Cu in amount close to an equivalent monolayer. Chronoamperometric results have been shown to follow an instantaneous 3D nucleation and diffusion-controlled growth model. The values of diffusion coefficient D for Cu²⁺, number of nuclei N and average nuclei radius r _av have been calculated. In the local regions of the surface, the separate large agglomerates composed of the different diameter clusters have been revealed in both cases, but, in the presence of the H₂SeO₃, they attained a distinct chain-like configuration. Some morphological characteristics have been reported.