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Fabricated wearable and flexible chip composed strain of gallium and silver metals composites assembled on graphene inside PDMS matrix
Authors:Ameen Abdelrahman  Fouad Erchiqui  M. Nedil
Affiliation:1. Material Science Department / School of Engineering, Université Du Québec en Abitibi-Témiscamingue (UQAT), 445 Boulevard de l’Université, Rouyn-Noranda, QC, J9X 5E4, Canada;2. Professeure- D''université | UQAT - Université Du Québec en Abitibi-Témiscamingue, 445 boul. de l''Université, Rouyn-Noranda, J9X 5E4, Canada;3. Professeur Titulaire / Professor Directeur Du programme de la maîtrise en ingénierie École de génie / School of Engineering, Université Du Québec en Abitibi-Témiscamingue (UQAT), Campus de Val D''Or, 675, 1ère Avenue, Val D’Or, Québec, J9P 1Y3, Canada
Abstract:With a view to creating a specific unique chip, its wearable, flexible and conductor.utilizing conventional physical methods like grafting and assembling metals (silver, copper, and gallium indium alloy) on graphene as composite, then immersed inside PDMS matrix. However, there is an incompatibility between liquid gallium and graphene sheet. So we used the abridge of metallic nanoparticles as silver and copper as a boundary barrier to its different charges to maximize interfacial surface interaction in between amorphous carbon and liquid gallium. to evaluate the chip conduct during the fabrication process we utilize various characterization such as electrochemical EIS and CVT to justify conductivity besides electrochemical reaction and oxidation and reduction, addition to measure the dielectric constant (?) of a composite at a different range of frequencies which is equal to 3.73 compared to PDMS 2.69.moreover its thermal stability (DSC) of prepared composite and tensile stress as an inductor for enforcement and enhancement physical properties, as well as, surface Morphology techniques characterize using TEM IR, and UV absorption.
Keywords:PDMS  Tensile response  Graphene  Ag  Cu nanoparticles  Electrochemical impedance. DSC
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