| 温度扫描分析在电路仿真中的应用 |
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| 引用本文： | 卢超,尹继武.温度扫描分析在电路仿真中的应用[J].武汉大学学报(理学版),2005(Z2). |
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| 作者姓名： | 卢超 尹继武 |
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| 作者单位： | 陕西理工学院物理系 陕西汉中723000 |
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| 基金项目： | 陕西理工学院教学改革研究资助项目(YJG0421) |
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| 摘 要： | 在电子设计或实验教学中了引入了温度扫描仿真分析.基于温度扫描分析计算机仿真的基本原理,通过实践总结出利用仿真软件Multisim进行温度扫描仿真分析的步骤和注意事项,并以温度测量电路和负反馈放大电路为应用实例,详细探讨了温度扫描分析在电路仿真中的应用.
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| 关 键 词： | 温度扫描分析 Multisim 仿真分析 电路 |
Applications of Temperature Sweep Analysis in Circuit Simulation |
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| LU Chao,YIN Ji-wu.Applications of Temperature Sweep Analysis in Circuit Simulation[J].JOurnal of Wuhan University:Natural Science Edition,2005(Z2). |
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| Authors: | LU Chao YIN Ji-wu |
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| Abstract: | Taking Temperature Sweep Analysis(TSA) as experimental method is provided in electronic design and teaching.Based on the elementary principles and practices,the steps and the warnings in adopting the simulation Software Multisim during Temperature Sweep Analysis are generalized.This article is about the applications Circuit simulation,with the temperature testing circuit and negative-feedback amplifying circuit as examples. |
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| Keywords: | temperature sweep analysis(TSA) Multisim emulation analysis circuit |
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