Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate |
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| Affiliation: | 1. Key Laboratory for Precision & Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, People’s Republic of China;2. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian 116024, People’s Republic of China;3. School of Electrical Engineering and Information, Dalian Jiaotong University, Dalian, People’s Republic of China;1. BuBclean, Institutenweg 25, 7521PH Enschede, The Netherlands;2. Mesoscale Chemical Systems Group, University of Twente, 7500AE Enschede, The Netherlands;1. Research Laboratory of Advanced Water and Wastewater Treatment Processes, Department of Applied Chemistry, Faculty of Chemistry, University of Tabriz, 51666-16471 Tabriz, Iran;2. Department of Chemical Engineering, Tabriz Branch, Islamic Azad University, 51579-44533 Tabriz, Iran;3. School of Mechanical Engineering, Yeungnam University, 712-749 Gyeongsan, South Korea;4. Center for Research Facilities, Yeungnam University, 712-749 Gyeongsan, South Korea;1. SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University, Suwon 440-746, Republic of Korea;2. Department of Chemistry, Sungkyunkwan University, Suwon 440-746, Republic of Korea;1. State Key Laboratory of Food Science and Technology, Jiangnan University, 1800 Lihu Road, Wuxi 214122, China;2. School of Food Science and Technology, Jiangnan University, 1800 Lihu Road, Wuxi 214122, China;3. College of Life Science and Technology, Southwest University of Science and Technology, Mianyang 621011, China |
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| Abstract: | Micro electroforming is an important technology, which is widely used for fabricating micro metal devices in MEMS. The micro metal devices have the problem of poor adhesion strength, which has dramatically influenced the dimensional accuracy of the devices and seriously limited the development of the micro electroforming technology. In order to improve the adhesion strength, ultrasonic agitation method is applied during the micro electroforming process in this paper. To explore the effect of the ultrasonic agitation, micro electroforming experiments were carried out under ultrasonic and ultrasonic-free conditions. The effects of the ultrasonic agitation on the micro electroforming process were investigated by polarization and alternating current (a.c.) impedance methods. The real surface area of the electroforming layer was measured by cyclic voltammetry method. The compressive stress and the crystallite size of the electroforming layer were measured by X-ray Diffraction (XRD) method. The adhesion strength of the electroforming layer was measured by scratch test. The experimental results show that the imposition of the ultrasonic agitation decreases the polarization overpotential and increases the charge transfer process at the electrode–electrolyte interface during the electroforming process. The ultrasonic agitation increases the crystallite size and the real surface area, and reduces the compressive stress. Then the adhesion strength is improved about 47% by the ultrasonic agitation in average. In addition, mechanisms of the ultrasonic agitation improving the adhesion strength are originally explored in this paper. The mechanisms are that the ultrasonic agitation increases the crystallite size, which reduces the compressive stress. The lower the compressive stress is, the larger the adhesion strength is. Furthermore, the ultrasonic agitation increases the real surface area, enhances the mechanical interlocking strength and consequently increases the adhesion strength. This work contributes to fabricating the electroforming layer with large adhesion strength. |
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| Keywords: | MEMS Micro electroforming Ultrasonic agitation Adhesion strength Compressive stress Polarization |
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