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Microscale Experiments at Elevated Temperatures Evaluated with Digital Image Correlation
Authors:N J Karanjgaokar  C-S Oh  I Chasiotis
Institution:(1) Mechanical Science and Engineering, University of Illinois, Urbana, IL, USA;(2) School of Mechanical Engineering, Kumoh National Institute of Technology, Gumi, South Korea;(3) Aerospace Engineering, University of Illinois, Urbana, IL, USA;
Abstract:The methods of uniform heating and resistive (Joule) heating for microscale freestanding surface-micromachined thin metal film specimens were evaluated by a combination of full-field strain measurements by optical microscopy/Digital Image Correlation (DIC) and microscopic infrared (IR) imaging. The efficacy of each method was qualitatively and quantitatively evaluated with the aid of strain fields and IR-obtained temperature distributions along 850 nm thick freestanding microscale specimens subjected to uniaxial tension while heated by each method. The strain and temperature fields were quite uniform in experiments carried out with uniform specimen heating except for minor end-effects at the specimen grips. However, the resistively heated specimens showed highly uneven temperature distribution varying by 50°C along the 1,000 μm specimen gauge length. This high temperature gradient resulted in strain localization and 40% reduction in yield and ultimate tensile strengths of resistively heated specimens compared to the uniformly heated ones. Therefore, it is concluded that resistive heating is not a reliable method for conducting microscale temperature experiments with metallic films.
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