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Large scale manufacturing of compound semiconductors by MOVPE
Authors:A. G. Thompson   R. A. Stall   W. Kroll   E. Armour   C. Beckham   P. Zawadzki   L. Aina  K. Siepel
Affiliation:

a EMCORE Corporation, 394 Elizabeth Avenue, Somerset, New Jersey 08873, USA

b M/A-COM Inc., 22300 COMSAT Drive, Clarksburg, Maryland 20871, USA

Abstract:As more compound semiconductor devices reach large volume manufacturing levels, a trend toward the use of the MOVPE technique is clear. In this paper we examine the criteria needed for MOVPE equipment suitable for large scale manufacturing. We find that although uniformity and device performance are necessary, reproducibility is also critical, along with high throughput and low operating costs. These points are illustrated by actual examples including MMIC power amplifiers, HB-LEDs, and solar cells. A realistic COO model provides a tool for evaluating MOVPE systems of different capacities. In situ control of key parameters during growth is now feasible, and will become an important method for increasing reproducibility and throughput. Lastly we look at the prospects for automation, for decreasing labor costs as well as wafer handling. This is likely to first have an impact on systems for the growth of electronic device structures on large (100 and 150 mm) wafers.
Keywords:
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