微电子封装结构设计与仿真分析

近年来半导体相关科技产品快速的朝高密度、高效能、多重物理特性与微小化发展，除上述 趋势外，微电子产品尚需保有高可靠度、低制造成本与缩短上市时程等必要特性才可应付国 际上激烈的竞争. 面对此一制程技术的快速变迁与高难度及高整合性制程革命性时代的到来， 下世代封装技术的研究发展已面临了极大的挑战. 随着产品的高复杂度与微小化的发展趋势， 若以传统实验及试误法(Try and Error)的设计方式来进行产品的研发，其所耗费的金额与时间将过于庞大与漫长，因此以模 拟分析法取代耗时耗钱的实验来进行产品研发的重要性与必然性已逐步提升，并受到国际各 半导体相关大厂的重视与采用.

SIMULATION AND DESIGN OF MICRO-ELECTRONIC PACKAGING

In recent years, the product of semiconductor related technologies tend toward to the direction of high density, high performance, multi-physics and miniaturization characteristics. Furthermore, high reliability, low fabrication cost and time-to-market features are the key elements making microelectronic devices to meet the worldwide highly competitive competition. Facing the aforementioned severe challenges, a new design methodology based on the computer simulation technology should be developed to adapt to the new era of ever so various fabrication processes, system integration and next generation electronic packaging devices. Miniaturization induced technology barriers such as process/material uncertainty, structural complexity, high fabrication cost and long development cycles, etc. make conventional design procedure (experiment based design technology, e.g., try-and-error method) inapplicable. Therefore, nowadays, simulation based design-on-simulation design concept has been widely adopted as the mainstream technology by worldwide semiconductor related companies and institutions.