A theoretical model of reversible adhesion in shape memory surface relief structures and its application in transfer printing |
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| Institution: | 1. Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, PR China;2. Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China;3. National Key Laboratory of Science and Technology on Advanced Composite in Special Environments, Harbin Institute of Technology, Harbin 150080, PR China;4. Institute of Flexible Electronics Technology of THU, Zhejiang, Jiaxing 314006, PR China;5. Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute for Bio-Nanotechnology, Northwestern University, Evanston, IL 60208, United States;6. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, United States;7. Departments of Civil and Environmental Engineering, Mechanical Engineering and Materials Science and Engineering, Northwestern University, Evanston, IL 60208, United States;1. Department of Engineering Mechanics; Center for Mechanics and Materials, Tsinghua University, Beijing, 100084, China;2. Guangzhou Institute of Building Science, Technology Development Center, 510440, China;3. School of Logistics Engineering, Wuhan University of Technology, Wuhan, China;4. Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA;5. Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, South Korea;6. Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science; Center for Bio-Integrated Electronics; Simpson Querrey Institute for Nano/biotechnology; Northwestern University, Evanston, Illinois 60208, USA |
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| Abstract: | Transfer printing is an important and versatile tool for deterministic assembly and integration of micro/nanomaterials on unusual substrates, with promising applications in fabrication of stretchable and flexible electronics. The shape memory polymers (SMP) with triangular surface relief structures are introduced to achieve large, reversible adhesion, thereby with potential applications in temperature-controlled transfer printing. An analytic model is established, and it identifies two mechanisms to increase the adhesion: (1) transition of contact mode from the triangular to trapezoidal configurations, and (2) explicit enhancement in the contact area. The surface relief structures are optimized to achieve reversible adhesion and transfer printing. The theoretical model and results presented can be exploited as design guidelines for future applications of SMP in reversible adhesion and stretchable electronics. |
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| Keywords: | Reversible adhesion Surface relief structures Transfer printing Stretchable and flexible electronics Shape memory polymer |
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