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Evolution of stress and strain relaxation of Ge and SiGe alloy films on Si(0 0 1)
Authors:R. Koch   G. Wedler  B. Wassermann
Affiliation:

a Paul-Drude-Institut für Festkörperelektronik, FG Nanoakustik, Hausvogteiplatz 5-7, D-10117 Berlin, Germany

b Institut für Experimentalphysik, Freie Universität Berlin, Arnimallee 14, D-14195 Berlin, Germany

Abstract:The growth of Ge and SiGe alloy films on Si substrates has attracted considerable interest in the last years because of their importance for optoelectronic devices as well as Si-based high speed transistors. Here we give a short overview on our recent real time stress measurements of Ge and SiGe alloy films on Si(0 0 1) performed with a sensitive cantilever beam technique and accompanied by structural investigations with atomic force microscopy. Characteristic features in the stress curves provide detailed insight into the development and relief of the misfit strain. For the Stranski–Krastanow system Ge/Si(0 0 1) as well as for SiGe films with Si contents below 20%, the strain relaxation proceeds mainly into two steps: (i) by the formation of 3D islands on top of the Ge wetting layer; (ii) via misfit dislocations in larger 3D islands and upon their percolation.
Keywords:Intrinsic stress   Atomic force microscopy   Epitaxy   Germanium   Silicon   Semiconducting films   Quantum dots
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