Synthesis of ultraviolet curable encapsulating adhesives and their package applications for organic optoelectronic devices |
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| Authors: | Shih-Hsun Lin Jian-Shian Lin Nien-Po Chen Cheng-Hao Ko Fuh-Shyang Juang Ming-Hua Chung Chen-Ming Chen Lung-Chang Liu |
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| Institution: | aGraduate Institute of Automation and Control, National Taiwan University of Science and Technology, Taipei 100, Taiwan;bDepartment of Electro-Optical Engineering, Yuanze University, Taoyuan 320, Taiwan;cInstitute of Electro-Optical and Materials Science, National Formosa University, Huwei, Yunlin 63208, Taiwan;dMaterial and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 30011, Taiwan |
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| Abstract: | With conventional heating process, ultraviolet (UV) illumination, and microwave irradiation, we have successfully synthesized UV curable encapsulating adhesives with excellent gas barrier capabilities, good adhesive strength, moderate hardness, and high refractive indices. The experimental results manifest that the physical properties of lab-made encapsulating adhesives are highly dependent on their chemical structures and synthetic procedure. We also discover that the encapsulating adhesive prepared by microwave irradiation (i.e. encapsulating adhesive VI-MW) exhibits better adhesive strength and higher gas resistance than those prepared by conventional heating process and UV illumination. Furthermore, encapsulating adhesive VI-MW has also been applied for the package of organic light emitting diodes (OLEDs), flexible OLEDs, and organic solar cells. With encapsulating adhesive VI-MW, the entry of oxygen and moisture in the air into these organic optoelectronic devices has been blocked, therefore enhancing the lifetimes. |
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| Keywords: | Encapsulating adhesive Package Optoelectronic device Organic light emitting diode Organic solar cell |
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