Messung der Fehlordnungsenergie an abschreckend kondensiertem Kupfer bei tiefer Temperatur

Copper films are produced by quenching condensation on a substrate at low temperature. A stored energy release of 216 cal/mole and a resistivity decrease of 1.8μΩcm are observed during annealing from 20 to 60 °K. In this temperature range the recovery of the films is described by a crystallisation of highly disordered material between small crystallites, which are produced during condensation. About 14 atomic-% of the whole film substance take part in this process. The stored energy-resistivity ratioE/Δ? found is 1.9 cal/g/gm/gWcm in the whole temperature range from 20 to 60 °K. This value is in good agreement with the stored energy measurements on neutron-bombarded copper.