Exact solution for mixed boundary value problems at anisotropic piezoelectric bimaterial interface and unification of various interface defects |
| |
| Institution: | 1. Ecole Superieure de Physique et de Chimie Industrielles de la Ville de Paris, 10 Rue Vauquelin, Paris, Ile-de-France, France;2. Gdańsk University of Technology, Gdańsk, Poland;3. R. E. Alekseev Nizhny Novgorod Technical University, Minin St., 24, Nizhny Novgorod 603950, Russia;4. Aberystwyth University, Ceredigion SY23 3BZ, Wales, UK;1. Belarusian State University, Minsk, Belarus;2. Department of Civil and Environmental Engineering and Architecture (DICAAR), University of Cagliari, Via Marengo, 2, Cagliari 09123, Italy;3. Faculty of Civil and Environmental Engineering, Gdańsk University of Technology, ul. Gabriela Narutowicza 11/12Gdańsk 80-233, Poland;4. R. E. Alekseev Nizhny Novgorod Technical University, Minin St., 24, Nizhny Novgorod 603950, Russia;1. Faculty of Civil and Environmental Engineering, Gdańsk University of Technology, ul. Gabriela Narutowicza 11/12 80-233 Gdańsk, Poland;2. Don State Technical University, Gagarina sq., 1, Rostov on Don 344000, Russia;3. Department of Mechanical Engineering, Indian Institute of Technology Kanpur, Kanpur 208016, India |
| |
| Abstract: | The special mixed boundary value problem in which a debonded conducting rigid line inclusion is embedded at the interface of two piezoelectric half planes is solved analytically by employing the 8-D Stroh formalism. Different from existing interface insulating crack model and interface conducting rigid line inclusion model, the presently analyzed model is based on the assumption that all of the physical quantities, i.e., tractions, displacements, normal component of electric displacements and electric potential, are discontinuous across the interface defect. Explicit solutions for stress singularities at the tips of debonded conducting rigid line inclusion are obtained. Closed form solutions for the distribution of tractions on the interface, surface opening displacements and jump in electric potential on the debonded inclusion are also obtained, in addition real form solutions for these physical quantities are derived. Various forms of interface defect problems encountered in practice are solved within a unified framework and the stress singularities induced by those interface defects are discussed in detail. Particularly, we find that the analysis of interface cracks between the embedded electrode layer and piezoelectric ceramics can also be carried out within the unified framework. |
| |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
