Optical substrate thickness measurement system using hybrid fiber-freespace optics and selective wavelength interferometry

Proposed and demonstrated is a simple few components non-contact thickness measurement system for optical quality semi-transparent samples such as Silicon (Si) and 6H Silicon Carbide (SiC) optical chips used for designing sensors. The instrument exploits a hybrid fiber-freespace optical design that enables self-calibrating measurements via the use of confocal imaging via single mode fiber-optics and a self-imaging type optical fiber collimating lens. Data acquisition for fault-tolerant measurements is accomplished via a sufficiently broadband optical source and a tunable laser and relevant wavelength discriminating optics. Accurate sample thickness processing is achieved using the known material dispersion data for the sample and the few (e.g., 5) accurately measured optical power null wavelengths produced via the sample etalon effect. Thicknesses of 281.1 μm and 296 μm are measured for given SiC and Si optical chips, respectively.