| HDI板埋孔填胶工艺研究 |
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| 引用本文： | 林灿荣,李艳国.HDI板埋孔填胶工艺研究[J].印制电路信息,2012(4):164-167. |
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| 作者姓名： | 林灿荣 李艳国 |
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| 作者单位： | 广州兴森快捷电路科技有限公司,广东广州,510663 |
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| 摘 要： | HDI板在生产过程中用LD半固化片填胶的加工工艺。分别通过理论计算分析了LD半固化片(1037)理论含胶量及实际所需胶量的一种量化关系,并以田口-DOE实验法探讨了LD半固化片填胶过程中表面凹陷产生的主要原因,对制作HDI使用半固化片直接填孔选材与工艺有重要的参考意义。
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| 关 键 词： | HDI 埋孔 半固化片 填孔性能 |
Research on resin filling technology of HDI buried hole |
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| LIN Can-rong,LI Yan-guo.Research on resin filling technology of HDI buried hole[J].Printed Circuit Information,2012(4):164-167. |
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| Authors: | LIN Can-rong LI Yan-guo |
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| Institution: | LIN Can-rong LI Yan-guo |
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| Abstract: | The processing technology of resin filling,using LD Prepreg in HDI production process,was elaborated in this article.The main reason of the filling surface indentation of LD Prepreg(1037) and a quantitative relationship of the theoretical and the actual desired gel content,which have important reference value for choosing Prepreg material directly to fill holes of produced HDI and produced technology,was analyzed by the theoretical calculation and probed by the Taguchi experiment method,respectively. |
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| Keywords: | HDI buried hole Prepreg filling performance |
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