High‐resolution resist for screen printing: application to direct fabrication of Ag circuit |
| |
| Authors: | Haruyuki Okamura Minoru Kayanoki Kohei Takada Hideyuki Nakajiri Keiko Muramatsu Munenori Yamashita Masamitsu Shirai |
| |
| Institution: | 1. Department of Applied Chemistry, Osaka Prefecture University, , Osaka, 599‐8531 Japan;2. Shin‐Nakamura Chemical, Co., Ltd., , Wakayama, Japan;3. Nakanuma Art Screen, Co., Ltd., , Kyoto, Japan;4. Industrial Technology Center of Wakayama Prefecture, , Wakayama, Japan |
| |
| Abstract: | High‐resolution screen printing was devised. New resist formulation contains a base polymer, which consists of acid‐labile tetrahydropyranyl‐protected carboxylic acid, hydroxyl, and methacrylic functions. As crosslinkers, multifunctional acrylates were employed. Photoacid generators were used for pattern formation. A 10‐µm feature size of resist on a screen plate was obtained on irradiation at 365 nm and followed by development on a stainless steel screen. Post‐exposure curing improved the mechanical characteristics of the resist patterns. A 13‐µm feature size silver circuit was successfully printed on poly(ethylene terephthalate) film without defect. Copyright © 2011 John Wiley & Sons, Ltd. |
| |
| Keywords: | screen printing resist high resolution Ag circuit |
|
|
