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微晶硅薄膜晶体管稳定性研究
引用本文:李娟,吴春亚,赵淑云,刘建平,孟志国,熊绍珍,张芳. 微晶硅薄膜晶体管稳定性研究[J]. 物理学报, 2006, 55(12): 6612-6616
作者姓名:李娟  吴春亚  赵淑云  刘建平  孟志国  熊绍珍  张芳
作者单位:(1)科学技术部高技术研究发展中心,北京 100044; (2)南开大学光电子薄膜器件与技术研究所,天津 300071;南开大学光电子薄膜器件与技术天津市重点实验室,天津 300071;南开大学光电信息技术科学教育部重点实验室,天津 300071
基金项目:国家高技术研究发展计划(863计划);国家自然科学基金;天津市自然科学基金;教育部留学回国人员科研启动基金
摘    要:对有源区处于结构过渡区的微晶硅底栅薄膜晶体管,测试其偏压衰退特性时,观察到一种“自恢复”的衰退现象.当栅和源漏同时施加10 V的偏压时,测试其源-漏电流随时间的变化,发现源-漏电流先衰减、而后又开始恢复上升的反常现象.而当采用栅压为10 V、源-漏之间施加零偏压的模式时,源-漏电流随时间呈先是几乎指数式下降、随之是衰退速度减缓的正常衰退趋势.就此现象进行了初步探讨.关键词:过渡区硅材料微晶硅薄膜晶体管稳定性自恢复衰退

关 键 词:过渡区硅材料  微晶硅薄膜晶体管  稳定性  自恢复衰退
文章编号:1000-3290/2006/55(12)/6612-05
收稿时间:2005-12-28
修稿时间:2005-12-282006-08-21

Investigation on stability of microcrystalline silicon thin film transistors
Li Juan,Wu Chun-Ya,Zhao Shu-Yun,Liu Jian-Ping,Meng Zhi-Guo,Xiong Shao-Zhen,Zhang Fang. Investigation on stability of microcrystalline silicon thin film transistors[J]. Acta Physica Sinica, 2006, 55(12): 6612-6616
Authors:Li Juan  Wu Chun-Ya  Zhao Shu-Yun  Liu Jian-Ping  Meng Zhi-Guo  Xiong Shao-Zhen  Zhang Fang
Affiliation:Institute of Photo-electronic Thin Film Devices and Technology, Nankai University, Tianfin 300071, China; Key Laboratory of Photo-electronic Thin Film Devices and Technology of Tianjtn, Nankai University, Tianjin 300071, China ;Key Laboratory of Opto-electronic Information Science and Technology of Ministry of Education, Nankai University, Tianjin 300071, China ; Center of Research and Development for High Technology of Ministry of Science and Technology, Beijing 100044, China
Abstract:Instability of a bottom gate microcrystalline silicon (μc-Si) thin film transistor (TFT), of which the active layer was deposited by very high frequency-plasma enhanced chemical vapor deposition with silane concentration of 4% diluted by H2, was measured and compared under two different gate bias stress conditions. A new instability phenomenon of TFT under the voltage bias stress of Vgs=Vds=10 V was found, where the ratio of the source-drain current of μc-Si TFT to its initial value decreases first, then stays flat for a period of time, then increases. However, under the voltage bias stress of Vgs=10 V(Vds=0 V), the source-drain current of μc-Si TFT decreases as normal exponential decay. Analysis on the change of sub-threshold swing S and threshold voltage Vth with stress time indicated the recoverable degradation could have resulted from the electron trapping and releasing in μc-Si TFT treated by gate-bias stress with Vds≠0.
Keywords:transitional silicon   microcrystalline silicon thin film transistor   stability   recoverable degradation
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