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Numerical Solution of the Problem of the Limiting Current for the Copper Electrodeposition from a Solution of Cupric Sulfate and Sulfuric Acid in Conditions of Natural Convection
Authors:Volgin  V. M.  Grigin  A. P.  Davydov  A. D.
Affiliation:(1) Tula State University, Tula, Russia;(2) Frumkin Institute of Electrochemistry, Russian Academy of Sciences, Leninskii pr. 31, Moscow, 119071, Russia
Abstract:Equations for a boundary layer, written in self-similar variables, are integrated numerically to obtain distributions of concentration of ions Cu2+, H+, and SO42–; a hydrodynamic velocity; partial currents of electrolyte components; and the limiting current of copper deposition and determine the Rayleigh number for the system under consideration. The results are compared with an approximate analytical solution obtained earlier.
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