Polysiloxane Interpenetrating Network Materials as Electronic Device Encapsulants: Synthesis and Properties

Thermally curable interpenetrating networks employing short and long chain components were successfully prepared via the sol-gel route. Their mechanical properties were assessed and correlated to their composition and structure. The role of the organic cross-links was found to be a larger determinant of the mechanical properties than the inorganic network. Their low frequency dielectric properties were investigated and found to be comparable to those of conventional encapsulation materials. Observed mass losses at 523 K ranged between 3–5% after 1000 minutes, the suspected mechanism being the development of organic cross-links.