可延展结构的设计及力学研究新进展

可延展柔性电子器件克服了传统无机电子器件脆、硬的缺点，在保持优异电学性能的同时，以其优秀的可延展性极大拓展了微电子器件的应用范围，备受国内外学术界和电子产业界瞩目. 无机电子器件的可延展柔性化主要通过力学结构设计的方法实现，本文针对近两年具有代表性的三种可延展柔性结构设计，包括分形互联岛桥结构、折纸结构和剪纸结构，简要综述了这些结构的力学研究进展，彰显了力学在可延展柔性电子器件发展中的重要作用，并展望了未来的发展方向.

Recent Advances in Mechanics of Stretchable Designs

Strechable electronics can offer the performance of conventional wafer-based devices, and on top of that, they are capable of deforming to arbitrary shapes. This resulting technology has enabled many novel applications such as wearable electronics and epidermal electronics. The challenge in the development of stretchable electronics is the mismatch between the hard inorganic semiconductor materials (e.g., silicon) and the ductility requirements in the applications. One effective strategy to overcome this mismatch is to exploit stretchable design in new structure layouts bonded to compliant substrates at strategic locations. Among the several stretchable designs, the three typical ones newly developed since 2013 have drawn much attention, which are fractal bridge-island design, origami design and kirigami design. This paper reviews the advances on the mechanics of these three typical stretchable designs for stretchable electronics. Mechanics models and their comparisons with experiments and finite element simulations are overviewed to illustrate the key roles of mechanics in the development of stretchable electronics.