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A highly integrated single chip baseband IC for 2.5th generation multimedia oriented mobile phones
Authors:M. Huemer OVE  VDE   IEEE  TH. Lüftner OVE  R. Weigel VDE  IEEE  R. Hagelauer IEEE  J. Hausner VDE  IEEE
Affiliation:1. Fachhochschule Hagenberg, Kommunikations- & Informationstechnik, Hauptstra?e 117, A-4232, Hagenberg
2. System Architect, DICE GmbH & Co KG, Freist?dter Stra?e 401, A-4040, Linz
3. Head of the Institute for Electronics Engineering, University of Erlangen-Nuremberg, Cauerstra?e 9, D-91058, Erlangen, Germany
4. Head of the Department: Research Institute for Integrated Circuits, University of Linz, Freist?dter Stra?e 315, A-4040, Linz
5. Director of the department: Strategy and Concept Engineering for Wireless Solutions, Infineon Technologies AG, Rosenheimer Stra?e 116, D-81541, München
Abstract:
Keywords:
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