首页 | 本学科首页   官方微博 | 高级检索  
     检索      


The influence of dopant species on thermal stability of NiSi film
Authors:Hiroshi Kimura  Ryuji Tomita
Institution:a Test and Analysis Engineering Division, NEC Electronics Corp., 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
b Process Technology Division, NEC Electronics Corp., 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1198, Japan
Abstract:We investigated the relationship between thermal stability of NiSi films and the implanted dopant species on Si substrates. The most stable NiSi layer appeared on Boron-implanted Si substrate, where the formation of pseudo-epitaxial transrotational structure was observed, just in case that the dose of boron is more than 5e15 atoms/cm2. This unique crystallographic orientation of NiSi film on Boron-implanted substrate is a key role of thermal stability because thermal stress at grain boundary can be diminished by peculiar arrangement of transrotational domains, owing to the anisotropy in coefficient of thermal expansion (CTE) of NiSi.
Keywords:NiSi  Transrotational structure  TED  Thermal stability  XRD
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号