| 硅片研磨表面状态的改善和研磨液的改进 |
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| 引用本文： | 张伟,周建伟,刘玉岭,刘承霖.硅片研磨表面状态的改善和研磨液的改进[J].半导体技术,2006,31(10):758-761,765. |
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| 作者姓名： | 张伟 周建伟 刘玉岭 刘承霖 |
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| 作者单位： | 河北工业大学,微电子研究所,天津,300130 |
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| 摘 要： | 在硅片研磨过程中,由于应力的积累和剧烈的机械作用,硅片表面损伤严重,碎片率增加.介绍了一种改进的研磨液,不但把剧烈的机械作用转变为比较缓和的化学-机械作用,还能起到其他较好的辅助作用并对其各成分作用,进行了理论分析.硅片表面状态得到了一定程度的改善,提高了生产效率.
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| 关 键 词： | 硅片 研磨 研磨液 应力 硅片研磨 表面状态 改善 研磨液 改进 Polishing Wafer Process Slurry Surface Condition 生产效率 程度 分析 理论 辅助作用 成分 化学 比较 作用转变 机械作用 |
| 文章编号： | 1003-353X（2006）10-0758-04 |
| 收稿时间： | 2006-05-09 |
| 修稿时间： | 2006-05-09 |
The Improvement of Wafer Surface Condition and Polishing Slurry in the Process of Wafer Polishing |
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| ZHANG Wei,ZHOU Jian-wei,LIU Yu-ling,LIU Cheng-lin.The Improvement of Wafer Surface Condition and Polishing Slurry in the Process of Wafer Polishing[J].Semiconductor Technology,2006,31(10):758-761,765. |
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| Authors: | ZHANG Wei ZHOU Jian-wei LIU Yu-ling LIU Cheng-lin |
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| Institution: | Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China |
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| Abstract: | In the process of wafer polishing, the wafer surface could be damaged badly and fragment rate will increase sharply, because of the accumulation of stress and the mechanical action. A kind of polishing slurry is introduced to change the fierce mechanical action into the tender chemical-mechanical action, and some positive effect can also be made by it. The wafer surface condition is improved to some extent, and the production efficiency is increased. |
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| Keywords: | silicon wafer polishing polishing slurry stress |
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