| 红外倒焊机的结构和改进 |
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| 引用本文： | 田种运,孙娟,卢德明.红外倒焊机的结构和改进[J].光学技术,1998(3). |
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| 作者姓名： | 田种运 孙娟 卢德明 |
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| 作者单位： | 昆明物理研究所 |
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| 摘 要： | 对准倒焊机是制备混合红外焦平面阵列（ＨＩＲＦＰＡ）所必需的设备。ＨＤＤ－１型红外倒焊机是国内第一台自行研制的光机电仪器。叙述了本仪器的原理、特性和在ＨＩＲＦＰＡ中的应用，讨论了该仪器的对准精度，提出了采用自动校准器改进上、下两个焊接面找平的实施方法。
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| 关 键 词： | 红外，倒焊机，结构 |
The structure and improvement of infrared flip chip alignment bonder |
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| Tian Zhongyun,Sun Juan,Lu Deming.The structure and improvement of infrared flip chip alignment bonder[J].Optical Technique,1998(3). |
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| Authors: | Tian Zhongyun Sun Juan Lu Deming |
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| Abstract: | Type HDD 1 Alignment Bonder is necessary for aligning and bonding of hybrid infrared focal plane array (HIRFPA) and other two sample with facing patterns. Type HDD 1 has been designed and produced.The principle performance and application in HIRFPA are presented. Accuracy of superimposed images method for the alignment of HIRFPA is discussed. Present effort is focused in increased two autocollimators. |
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| Keywords: | infrared flip chip alignment bonder structure |
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