铜镍和铜钴合金电极在碱性介质中的光电化学

用动电位伏安法对含镍量10％、30％和50％的铜镍合金以及含钴量5.1％、9.7％、15 ％、25％和40％的铜钴合金电极在硼砂-硼酸缓冲溶液（pH 8.5）中的光电化学行为进行了 研究.铜镍合金和铜钴合金均显示p-型光响应，铜镍合金的光响应来自Cu2O，铜钴合金的光 响应来自Cu2O和氧化钴.含镍量10％和30％的铜镍合金电极以及含钴量5.1％铜钴合金电极的 最大光电流iph，max均大于纯铜电极，含钴量15％、25％和40％的铜钴合金电极以及含镍量 50％的铜镍合金电极由于电极表面相当一部分面积分别被氧化钴和氧化镍所占有，iph，max 小于纯铜电极.铜镍合金电极的φv值（电位负向扫描过程中电极表面完全还原为Cu时的电位 ）负于纯铜电极，而铜钴合金电极的φv值与纯铜电极大致相等， NiO的存在致使铜镍合金 表面Cu2O膜具有更大的稳定性.从光电化学角度通过φv和iph，max反映铜合金的耐腐蚀性能 与交流阻抗法测得的结果相符.

Photoelectrochemical Study of Copper-Nickel and Copper-Cobalt Electrodesin Alkaline Solution

The electrochemical behavior of 10％Ni-90％Cu, 30％Ni-70％Cu, 50％Ni -50％Cu,5.1％Co-94.9％Cu, 9.7％Co-90.3％Cu, 15％Co-85％Cu, 25％Co-75％Cu an d 40％Co-60％Cu alloys electrodes in a borax buffer solution(pH 8.5) was studie d by cyclic voltammetry, AC impedance spectroscopy and photocurrent response met hod. The copper-nickel and copper-cobalt electrodes all show p-type photoresp onses. The photoresponses of the copper-nickel electrodes come from Cu2O while those of the copper-cobalt electrodes are caused by Cu2O and cobalt oxides. iph ,max of 10 ％Ni-90 ％Cu, 30 ％Ni-70 ％Cu and 5.1 ％Co-94.9 ％Cu alloy electro des is larger than that of pure copper electrode. However, iph,max of 50％Ni-50 ％Cu, 15％Co-85％Cu,25％Co-75％Cu and 40％Co-60％Cu alloy electrodes is small er than that of pure copper electrode because there are nickel and cobalt oxides on the greater part of the surface of those electrodes. φv of the copper-nick el electrodes is more negative than that of pure copper electrode while φv of t he copper-cobalt electrodes is almost equal to that of pure copper electrode. N iO results in a more stability of Cu2O layer on the copper-nickel electrodes su rface. The results from photoelectrochemical measurements favourably agree with those by AC impedance technique.