| 多层芯片堆叠封装方案的优化方法 |
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| 引用本文： | 郑建勇,陈一杲,张志胜,史金飞.多层芯片堆叠封装方案的优化方法[J].半导体技术,2009,34(11). |
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| 作者姓名： | 郑建勇 陈一杲 张志胜 史金飞 |
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| 作者单位： | 东南大学,机械工程学院,南京,211189;江苏长电科技股份有限公司,江苏,江阴,214431 |
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| 摘 要： | 芯片堆叠封装是提高存储卡类产品存储容量的主流技术之一,采用不同的芯片堆叠方案,可能会产生不同的堆叠效果.针对三种芯片堆叠的初始设计方案进行了分析,指出了堆叠方案失败的原因和不足.结合两种典型芯片堆叠封装结构(金字塔型和悬梁式)的特点,提出了一种采用转接芯片完成焊盘转移的优化方法,并举例进行了芯片堆叠封装方案的说明.最后,对转接芯片的制作及尺寸设计原则进行了研究.
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| 关 键 词： | 芯片堆叠 封装 优化方法 存储卡类产品 |
Optimized Method of Multi-Layer Stacked Chip Package Scheme |
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| Zheng Jianyong,Chen Yigao,Zhang Zhisheng,Shi Jinfei.Optimized Method of Multi-Layer Stacked Chip Package Scheme[J].Semiconductor Technology,2009,34(11). |
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| Authors: | Zheng Jianyong Chen Yigao Zhang Zhisheng Shi Jinfei |
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| Institution: | Zheng Jianyong1,Chen Yigao2,Zhang Zhisheng1,Shi Jinfei1(1.School of Mechanical , Engineering,Southeast University,Nanjing 211189,China,2.Jiangsu Changjiang Electronics Technology Co.Ltd.,Jiangyin 214431,China) |
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| Abstract: | 3D stacked chip package is one of the mainstream technologies in improving the storage capacity of memory card products.Different stacked chip schemes will also possibly produce different stacked package effects.Three initial design schemes of stacked chip package were analyzed,and the reasons for the failure of the schemes were pointed out.One optimized method to transfer the die pad by the adapter chip was presented,which was combined by the two typical stacked chip packages(pyramid and cantilever).Furthe... |
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| Keywords: | stacked chip package optimized method memory card product |
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