一种Ka频段瓦片式TR组件子阵集成方案

提出了一种Ka频段瓦片式TR组件子阵集成方案，采用多层电路技 术、内层带状线功分器、优化脊波导口径、同型端口集中分布等手段大幅提高集成度，采用 高可靠性小截面脊波导实现模块间高性能垂直互联。给出了TR组件子阵电路布局设计，对小 截面脊波导传输特性、脊波导-微带探针过渡和集成功率分配网络等关键无源电路进行了设 计、仿真和测试。测试结果表明其性能和尺寸满足Ka频段TR组件子阵集成要求。

A sub-array integration solution for Ka-band tile-type TR module

A new sub-array integration solution for Ka band tile-type TR module is proposed . By applying multilayer circuit technology, inner layer stripline power divider , section optimized ridge waveguide, same type ports centralized distribution, t he circuit integration level is increased substantially. Low cross-profile ridge waveguide is employed as vertical interconnection between modules. Layout of su b-array circuit is provided. Passive components such as ridge waveguide transiti on and divider are modeled, simulated and demonstrated. The result shows that th e size and performance of these passive circuits can fulfill the integration req uirements.