A survey of surface mount device placement machine optimisation: Machine classification

The optimisation of a printed circuit board assembly line is mainly influenced by the constraints of the surface mount device (SMD) placement machine and the characteristics of the production environment. This paper surveys the characteristics of the various machine technologies and classifies them into five categories (dual-delivery, multi-station, turret-type, multi-head and sequential pick-and-place), based on their specifications and operational methods. Using this classification, we associate the machine technologies with heuristic methods and discuss the scheduling issues of each category of machine. We see the main contribution of this work as providing a classification for SMD placement machines and to survey the heuristics that have been used on different machines. We hope that this will guide other researchers so that they can subsequently use the classification or heuristics, or even design new heuristics that are more appropriate to the machine under consideration.